Case Study

半導体 3D計測 Project 107

A 半導体 case covering measurement planning, on-site capture, deviation analysis, and reporting for 軌道検測基準点.

Issue

The project required repeatable measurement of 軌道検測基準点 under a short shutdown window, with clear reference points and acceptance criteria.

Scope

The team prepared a measurement plan, captured field data, compared results with CAD references, and organized deviation maps and inspection records.

Result

The project standardized evaluation criteria and created a dataset that can be compared in future inspections.

Back to Works